• We design daisy chain boards for package evaluation.

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• In a daisy chain board, we put a dummy die with the correct interconnect points and bond it to a daisy chain board.

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• After the daisy chain board has been bonded, we subject the daisy chain board to thermal shock for 1000 hours, after which we pull out the boards to see if the interconnects are still intact.

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• This is our own secret “formula” to ensure the electronic packaging is robust, and the resulting product is of superior quality, with guaranteed performance, several years after it is launched.