• We also provide integrated circuit chip validation. Once the die comes out of the wafer fabrication, we provide services like putting the die in a scoop and goop package to ensure early validation of the silicon chip. This ensures the entire scoop and goop process gets completed in 3-5 days, which is quite remarkable considering normal electronic packaging takes 3-5 weeks.​

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• Scoop and goop methodologies are a quicker way to evaluate a silicon chip coming out of the fabrication area, and our company has the expertise in getting the scoop and goop completed in record time.