Advanced package engineering is stacking multiple dies or microchips into a single electronics package, as opposed to traditional packaging, which contains only a single chip in an electronic package. The wires shrink considerably along with the transistors and the amount of distance that a signal needs to travel from one end of a chip over thin wires is increasing at each node. By connecting these chips, using thicker pipes, which can be in the form of through-silicon vias, interposers, bridges, or simple wires, the speed of those signals can be increased, and the amount of energy required to drive those signals can be reduced. Moreover, depending on the package, there are fewer physical effects to contend with, and components developed at different process nodes can be mixed. The advantage of advanced package engineering is, it increases a device's performance and capability while reducing power consumption and cost.

The idea of stacking multiple dies is not new to the semiconductor industry, but very few engineers have the expertise to offer this design. Thus, finding services for advanced package engineering is still a challenge for many companies that require devices that demand this advanced and unique design, which has been slow to evolve in the semiconductor industry. 

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Advanced package engineering requires years of experience and vast knowledge to master this design. Here at Zener Engineering, we are capable of providing just that to meet the crucial demands of modern applications like artificial intelligence and autonomous vehicles, thus being able to leverage this technique for a truly competitive edge in the semiconductor industry.